TRIKUT INDUSTRIES fabricates high-efficiency Thermal Interface Foam Pads (TIM) and thermally conductive gap fillers engineered to optimize heat dissipation between electronic components and heat sinks or metal housings.
Our thermal pads conform to microscopic surface irregularities and wide assembly tolerances with low compressive stress, preventing damage to delicate silicon chips and PCB tracks. Available in silicone and non-silicone elastomer formulations with thermal conductivities ranging from 1.5 W/m-K up to 6.0 W/m-K, with fiberglass reinforcement for tear-free high-shear handling. Critical for electric vehicle (EV) battery packs, power management modules, LED lighting arrays, telecom transceiver enclosures, and automotive microcontrollers. Supplied custom kiss-cut with easy-peel carrier film.
